Nemcon™ S - Conductive and Shielding Compounds

Ovation Polymers™ Nemcon™ S line of shielding compounds is based on a variety of inorganic fillers. Depending on the properties needed, compounds based on, but not limited to, stainless steel, tungsten, iron oxides, nickel, brass, copper, and aluminum oxide can be utilized. Nemcon™ S offers an easy to process replacement to metals. Injection molding and extrusion grades are available.

Technical Features

Ceramic-Filled Compounds
Metal-Filled Compounds
Nano-Particle Hybrids

Broad Range of Conductivities Available:

EMI Shielding Grades
RFI Shielding Grades
ESD Grades

Custom Compounds Available:

Thermally Conductive Grades
Electrically Conductive Grades
Tunable Specific Gravities
Heat Retention Properties

Potential Applications

EMI Shielding:

Product Assembly Housings
Component Housings
Cable Shields
Gaskets

Radiation Shielding:

X-Ray Equipment
CT Scanning Devices

Ultrasound Shielding:

Product Assembly Housing

Medical Devices/Applications