• 2009 Patents - 15th patent application filed.
• ExTima™ GP - A Graphene/Polymer
  master batch family of compounds based
  on proprietary dispersion technology.
• Arcticon™ - Advanced thermally cooling
  composites are introduced.
• 2008 Patents - 13th patent application filed.
• Product Commercialization -
  Next-generation products gain increased
  user interest.

• Nima™ LSZH - Non-halogenized high
  density polyethylene FR compound is
  commercialized.
• Nemcon™ H - Thermally conductive
  compound is commercialized.
• OpteSTAT™ - Carbon nanotube-based
  conductive polymer product line introduced.
• Opnyl™ UT - Polyamide 66 based medium
  to high impact series of ultra-tough materials
  introduced.
• Nemcon™ E PE - HDPE based conductive
  compound with SR > 10E05 ohm^2 and low
  coefficient of friction introduced.

• Nemcon™ E - PET based conductive
  compound with SR > 10E05 ohms ^2 for melt
  fiber apps.
• Softaplas™ - Ultra soft injection moldable
  and extrudable grades of TPU alloys.
• Nemcon™ H - Thermally conductive
  composites with interplane conductivity of
  6.0 W/m-K.
• Nima™ FR PE - HDPE based halogenated FR
  compound for wire and cable applications.
• Nemcon™ E PE - HDPE based
  conductive compound with SR > 10E03
  ohms^2 for injection & extrusion.