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Ovation Polymers' innovation
process begins with a round of
Ideation which comes from being focused on application and
developmental trends in the technology areas and industries
we serve. This is followed by a careful
Project Selection process based on technical and
commercial viability matrices.
The technical team takes the project from the
Developmental
stage to the
Commercialization phase. Many times this happens in
collaboration with the client's technical team.
Our mutual
success
comes from blending fundamental research with practical
wisdom via significant collaborative efforts with our
clients.
Result:
A sustainable and growth oriented business, thus maximizing
return on investment for our clients and
Ovation Polymers.
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---- Our Product Innovations ----
Fourth Quarter 2007
Ovation Polymers commercializes flame retardant compounds.
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Nima NH PC Series: Non-Halogenated Flame Retardant Polycarbonate-based injection molding compounds featuring high Izod Impact Strength at room temperature and as low as –30°C.
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Nima HL 30000 GF Series: Halogenated Flame Retardant Polyethyleneterephthalate (PET) based fiberglass filled molding compounds for connectors and other electronic components.
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Nima NH OP Series: Non-Halogenated Flame Retardant Red Phosphorous-based Polyamide compounds. These compounds are available in PA6 and PA66 in filled and unfilled versions.
September 2007
Ovation Polymers debuts six product lines into the electronics industry and attends some of the most influential exhibitions.
OpteSTAT™: Carbon nanotube based electrically conductive compounds and composites.
Nemcon™ E: Electrically conductive compounds.
Nemcon™ H: Thermally conductive compounds.
UTTAP™: High performance alloys, blends, and composites.
LSE Series™: Self-lubricated, wear resistant compounds.
Nima™: Flame retardant compounds and master batches.
ESD Symposium: September 17-19, 2007 in Anaheim, CA.
Diskcon USA 2007: September 19-20, 2007 in Santa Clara, CA.
Nano App Summit: October 22-25, 2007 in Cleveland, OH.
NanoCon International: November 14-16, 2007 in Santa Clara, CA.
August 2007
July 2007
June 2007
Feb 2007
Jan 2007
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Opnyl™ UT - Polyamide 66 based medium to high impact series of
ultra- tough materials.
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Nemcon™ E PE - HDPE based conductive compound with SR in the order of 10E05
ohms/sq. and low
coefficient of friction (static and dynamic) for wire and
cable, profile extrusion, etc.
Dec 2006
Nov 2006
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Softaplas™ S Series - Ultra soft injection moldable and extrudable grades of TPU alloys with hardness ranging from
Shore 55A to 95A. These compounds have extremely good
chemical, thermal resistance, and hydrolytic stability. Main
applications will be for soft touch/grip applications,
tubing/hoses, films, etc.
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Nemcon™
E TPU - Conductive TPU alloys with SR > 10E05 ohms and
hardness randing from Shore 70A to 80D.
Oct 2006
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Nemcon™
H - Thermally conductive polymer composites with in-plane
thermal conductivity of 6.0 W/m-K in resin systems for PC,
PET, PP, PPS, PES, PEEK, and OPTEM brand alloys and blends.
Sept 2006
August 2006
July 2006
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